RFT-700

The GET Systems RFT-700 Plater is comprised of two vertical rotating domes, a micro porous plastic ring, and a cathode contact ring at the rim of each perimeter. Work is loaded at the top of each cell, them centrifugally compacted against the cathode ring for superior electrical contact as solutions are introduced into the top of the cell. The system is operated via a user-programmable logic controller with touch screen interface, and fully automatic and manual modes. The footprint is one-third smaller than 2 systems of equal capacity. Because of the dual plating cells, the RFT-700 allows for twice the plating capacity (up to 2 liters of parts).

• Does not require media for plating MLCC (0402-1210 size)
• The only commercial process for the 0201 chip
• Sequential process in a single machine
• 3-chemical reservoir tanks standard / 4 tanks optional (up to 7 processes)
• Closed circulation of chemistry for effective fume control
• High volume solution flow-through cell for high-speed plating
• Large cathode contact area
• Large work capacity: 300-1000ml (MLCC)
• Uses all standard plating baths with either soluble or insoluble anodes
• Plating solution is injected into anode for high performance
• Plating speeds 5 times faster than horizontal barrel plating process
• High-efficiency rinse (less than 25 liters per batch)
• Excellent deposit uniformity of thickness
• Higher purity deposit, minimum co-deposit

RFT-700 System Features

• Totally enclosed mechanics
• Molded tanks and drain basin. Eliminates leaking for a cleaner workstation
• Quick release cathodes for easier operator removal
• Touch screen controls and Automatic unload system
• Programmable state of the art Omron PLC processor

Protected by U.S. Patents 5,487,824 and 5,565,079
Japan Patent 7-118896
Other Foreign Patents Pending

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