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GET Systems is the global source for the patented Rotary Flow-Thru (RFT) technology. RFT plating is a pioneering breakthrough in the electroplating process. It is designed to change the way plating operations are managed by providing greatly increased process and scheduling control.
The GET Systems RFT-350XL Plater is an economical, multi-process single-station automated machine designed for fast, accurate bulk-process electroplating on surface-mount electronic components. What's more, it is designed to achieve the highest quality and accuracy completely without wasteful media.
With a footprint of 132cm x 198cm, the cost-effective RFT-350XL Plater is extremely compact. This compact size,
coupled with high-volume production and reduced
capital outlay, means that your equipment can
easily be multiplied to meet any future through-put
requirements.
100% CATHODE
EFFICIENCY.
That's right, 100%. With capabilities never
before available, the GET Systems RFT process can
successfully plate SMT chip capacitors and resistors to a
thickness uniformity of CV 8-15%. The RFT process can
microencapsulate micro components such as powder as small
as 25 microns in size without agglomeration or
bridging. This has never been done before in
a commercial process.
CLEAN &
GREEN
During the plating process, the RFT-350XL catch basin shifts and changes position over a return drain,
transferring to the next process completely
without "drag-out." This means that
multi-step processes can be carried out without
physically transferring the plating cell. Furthermore,
the need for hoists and open tanks is eliminated,
ensuring a clean work station. Less space, no media and
minimized waste make for an environmentally sensible
system.
OTHER IMPORTANT
CONSIDERATIONS.
Extraordinary efficiency is key.
With the RFT-350XL Plater you will more closely match your
capacity or through-put requirements to capital outlay. Additionally, thanks to the machine's small footprint and
cost efficiency, you will be able to incrementally grow
your production as needed. Translation: Minimized capital
outlay equals maximum return on assets.
Aside from cost efficiency and compact size, GET Systems technology has resulted in a number of other electroplating advances. The hydrodynamics of the cell and rotating cathode allow plating speeds up to five times faster than traditional methods.
Furthermore, because work remains in one place during the entire process, electroplated solder terminations on SMT electronic components can be processed with extreme accuracy and without wasteful media, resulting in even greater cost efficiency. Plated deposits have excellent uniformity of thickness and extraordinarily high purity.
A WORD ABOUT
THE ENVIRONMENT.
Elimination of wasteful media for SMT devices is just one
benefit of GET Systems RFT Platers. The unique design of
the rotating cathode ring, combined with the dynamic
flow-through of electrolyte, allows a high plating rate
of top quality and repeatability.
The RFT Plater's closed path circulation and enclosed-tank design means less exposure to corrosives, more recovered chemicals and significantly less rinse water consumption than with traditional drag-out methods. The overall result is greatly lowered environmental impact, not to mention enhanced safety for production personnel and reduced operating costs.
AND A WORD
ABOUT SPEED.
The RFT cell has proven to be a robust
chemical process capable of high amperage production with
highly accurate uniformity of thickness. This allows the
process engineer to balance the paradox of choosing
between quality and speed, because the RFT Plater
provides the best of both worlds.
The machine accomplishes cost-effective multi-step electroplating within a unique and versatile single-station site that boasts a CV percentages of just 8-15%. The RFT's compact size enables manufacturers to literally take the technology where it's needed, allowing more flexibility in schedule management and reducing the need for expensive manufacturing space.
By providing an impressive, compact means of cost-effective mass production, the GET Systems RFT Plater is a true revolution in precision electroplating. You'll recover your capital investment quickly, even as you improve your vital competitive edge in the ever-changing electronics industry.
GET SYSTEMS
ROTARY FLOW-THRU PLATER
SPECIFICATIONS AND CAPABILITIES
- Does not require media for plating MLCC (0402-1210 size)
- The only commercial process for the 0201 chip
- Sequential process in a single machine
- 3-chemical reservoir tanks standard
- Closed circulation of chemistry for effective fume control
- High volume solution flow-through cell for high-speed plating
- Large cathode contact area
- Large work capacity: 300-1400ml (MLCC)
- Uses all standard plating baths with either soluble or insoluble anodes
- Plating solution is injected into anode for high performance
- Plating speeds 5 times faster than horizontal barrel plating process
- High-efficiency rinse (less than 25 liters per batch)
- Excellent deposit uniformity of thickness
- Higher purity deposit, minimum co-deposit
RFT-350XL System Features
- Totally enclosed mechanics
- Molded tanks and drain basin. Eliminates leaking for a cleaner workstation
- Quick release cathodes for easier operator removal
- Touch screen controls and Automatic unload system
- Programmable state of the art Omron PLC processor
- Isolated anode stations for improved chemical segregation
- Recipe management available for up to 9 different recipes
- Host PC networking, available for central control of multiple machines
- Safety Interlocks and fully automatic or semi-auto control
- Components and parts interchangeable with the RFT-350A and RFT-700
- Wide range of cathode sizes 35mm to 140mm
- Extra large anodes standard
- Compact footprint (132cm x 198cm)
- CE certified unit available
RFT-350XL SYSTEM OVERVIEW
The GET Systems RFT-350XL Plater is comprised of a vertical rotating dome, a micro porous plastic ring or laser-cut slots, and a cathode contact ring at the perimeter. Work is loaded at the top of the RFT cell, then centrifugally compacted against the cathode ring for superior electrical contact as the chemical solutions are introduced into the top of the cell.
The system is operated via a user programmable logic control with touch screen interface, with fully automatic and manual modes. The GET Systems RFT-350XL Plater is production-proven and meets or exceeds all current performance specifications in the MLCC industry.
Protected by U.S. Patents 5,487,824 and
5,565,079
Japan Patent 7-118896
Other Foreign Patents Pending